Grinding

In daily life, the surface of the silicon chip after cutting has a certain degree of damage and deformation, and due to the limited feed accuracy of the slicer, the thickness of the silicon chip is more dispersive, so it is necessary to grind after slicing.

The essence of grinding silicon wafer is to make the silicon surface continuously rub with abrasive under certain pressure. The damage layer on the silicon wafer surface is removed by mechanical grinding. The grinding measurement is generally about 60P, while the damage caused by cutting silicon wafer is about 50u. The quality of the abrasive wafer can be improved by choosing the appropriate motion form and using the appropriate abrasive.

In addition to abrasives, appropriate abrasive ratio is also very important. The size and particle size of abrasive particles affect their surface roughness.

Selection is very important for manufacturers. Yongkang Penguin Grinding Wheel Factory was established in 1990. It is a well-known enterprise specialized in producing and selling resin grinding wheels. The company has the right of automation equipment, the introduction of advanced production technology, with complete testing equipment, the production of "Shenmo" and "Penguin" brand series grinding wheel quality is excellent. Contact number: 0579-87320579